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Lin J, Chen J, Lin W, He A, Hao X, Jiang Z, Wang W, Wang B, Wang K, Wei Y, et al. A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads. Micromachines. 2024; 15(7):900. https://doi.org/10.3390/mi15070900

Lin, Jie, Jiapeng Chen, Wenkun Lin, Anjie He, Xiaodong Hao, Zhenlin Jiang, Wenjun Wang, Baoxiu Wang, Kerong Wang, Ying Wei, and et al. 2024. "A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads" Micromachines 15, no. 7: 900. https://doi.org/10.3390/mi15070900

Lin, J., Chen, J., Lin, W., He, A., Hao, X., Jiang, Z., Wang, W., Wang, B., Wang, K., Wei, Y., & Sun, T. (2024). A Novel Noise Reduction Approach of Acoustic Emission (AE) Signals in the SiC Lapping Process on Fixed Abrasive Pads. Micromachines, 15(7), 900. https://doi.org/10.3390/mi15070900