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Journal: Micromachines, 2024
Volume: 15
Number: 557
557
Article: A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM
Authors: by Xiping Jiang, Xuerong Jia, Song Wang, Yixin Guo, Fuzhi Guo, Xiaodong Long, Li Geng, Jianguo Yang and Ming Liu
Link: https://www.mdpi.com/2072-666X/15/5/557

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