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Journal: Micromachines, 2024
Volume: 15
Number: 428

Article: A Study on the Reliability Evaluation of a 3D Packaging Storage Module under Temperature Cycling Ultimate Stress Conditions
Authors: by Shuai Zhou, Kaixue Ma, Yugong Wu, Shizhao Wang and Nian Cai
Link: https://www.mdpi.com/2072-666X/15/4/428

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