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Journal: Micromachines, 2024
Volume: 15
Number: 408
Article:
Multi-Step Mechanical and Thermal Homogenization for the Warpage Estimation of Silicon Wafers
Authors:
by
Zhouyi Xiang, Min Chen, Yonghui Deng, Songhua Huang, Sanli Liu and Ji Li
Link:
https://www.mdpi.com/2072-666X/15/3/408
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