An Improved Algorithm to Extract Moiré Fringe Phase for Wafer-Mask Alignment in Nanoimprint Lithography
Abstract
:1. Introduction
2. Principle
2.1. Alignment Principle
2.2. Phase-Processing Algorithm
2.2.1. Improved 2D-FWT Algorithm Theoretical Model
2.2.2. Annotations for Implementations of Algorithms
- (1)
- The conventional strategy for 2D-FFT implementation is used. A 2D Hanning bandpass filter is used to extract the +1-level spectrum. The filter bandwidth is manually determined based on the spectrum distribution characteristics. Minimize the filter size to reduce noise interference when using 2D-FFT, and maximize the size to extract the complete spectrum information using the 2D-FWT. Thus, there is a trade-off between noise or spectrum loss and spectrum extraction accuracy.
- (2)
- To balance the frequency and time resolutions, the size of the Gaussian window function is set as , with . To reduce spectral leakage, the frequency range must be extended to . Given that the frequency range of the fringe pattern is estimated by the FT as , the spectral range of the FWT is set as [28]. The sampling frequency must be adequately small to accurately locate the local frequencies in the frequency range. However, to ensure a reasonable run time, the sampling interval only needs to cover the window uniformly for dense sampling. Therefore, the sampling frequency can be set as , and a finer sampling frequency can be set if higher precision sampling is desired. In addition, the choice of the threshold considerably affects the phase extraction results: an excessively large threshold may lead to distortion of the eigen-signal, and an excessively small threshold may lead to noise leakage. Both cases may result in phase distortions. A larger threshold interval can be selected to achieve nearly optimal filtering results, followed by fine-tuning based on the desired phase extraction effect.
- (3)
- When processing fringe patterns with the WFF, the lower frequency limit of the right half-plane of the spectral range must be located between the 0- and +1-level spectrum to completely extract the spectrum and avoid the infiltration of the 0-level spectrum. In this context, the selection of the lower frequency limit is critical for algorithm debugging and must be undertaken as the first step. However, the small window size results in a very small distance between both spectrums, and as such, an adjustment is very time-consuming. After setting the lower frequency limit, the threshold can be further adjusted to optimize the results. Fortunately, the proposed 2D-FWT does not need to consider this.
2.2.3. Phase Unwrapping Algorithm
3. Simulation
3.1. Pre-Processing
- (1)
- Image pre-processing: The fringe contrast may be reduced due to illumination disturbances and mark fabrication defects. Morphological methods can improve the contrast. If the fringe is severely disturbed by noise, spatial filtering can be applied for noise reduction without losing the critical information of the original image.
- (2)
- Image segmentation: Because of the truncation of the Moiré fringe along the middle misalignment, the phase is discontinuous at this position. To solve this problem, the image is segmented into upper and lower parts along the middle pixel mutation and processed separately before performing phase extraction. This step can avoid the loss of key information of the fundamental frequency and reduce phase error.
- (3)
- Integral multiple truncations: According to the sampling theorem, the captured Moiré fringe pattern is truncated using an integer period () to reduce spectral leakage and improve the accuracy of the FWT algorithm.
3.2. Robustness Testing of Algorithms
4. Experiment
4.1. Alignment Marks Fabrication
4.2. Measurement System
4.3. Experimental Results
4.4. Uncertainty Analysis
5. Discussion
6. Conclusions
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
Appendix A
Error Source | Description |
---|---|
(1). Alignment mark fabrication error | Mark fabrication errors affect the Moiré fringe imaging quality. Although Moiré fringe can reduce grating etching errors, fabrication errors may lead to fringe distortion. Errors such as period deviations, etching position shifts, and shape irregularities affect the imaging and thus the alignment accuracy. |
(2). Alignment signal error | When the truncate fringe length is not an integer period, the truncate error may lead to spectral leakage, thereby limiting the phase extraction accuracy. In addition, the fringe is affected by the imaging contrast, which in turn affects the phase extraction quality. The in-plane angular displacement misalignment of the two markers will produce a tilted moiré fringe and affect the radial displacement measurement, so the two alignment markers need to be leveled before the experiment. |
(3). Image collection error | When collecting fringe images using CMOS cameras, spectral leakage may occur owing to the difference between the CMOS pixels and fringe periodicity. In addition, image collection is inevitably affected by dark currents and circuit noise, among other factors. These aspects may lead to phase variations and alignment errors. |
(4). Phase algorithm error | In fringe analysis, phase extraction and unwrapping algorithms may induce phase errors. Specifically, the accuracy is affected by noise, image distortion, signal-to-noise ratio, and the sampling interval. Unwrapping algorithms encounter challenges in scenarios involving phase discontinuities, especially when the phase variation is large or there exist multiple discontinuities. |
(5). PZT movement error | The movement error of PZT may lead to the accumulation of step experiment errors, thereby adversely affecting the alignment accuracy. |
(6). Wafer and mask stress distortion | During NIL alignment, contact between the wafer and mask may lead to changes in the local stress, resulting in distortion of the alignment marks. This distortion can directly affect the imaging quality of the fringe with shape distortion. |
(7). Environmental disturbances | Although we construct the experimental system on an optical platform inside an ultra-clean vibration isolation laboratory, external vibrations and airflow disturbances cannot be eliminated. These disturbances can affect the stability of the alignment marks and imaging quality of the Moiré fringe, thereby influencing the experimental results. |
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SD of Noise/Gray Level | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
---|---|---|---|---|---|---|---|---|---|---|
2D-FFT/nm | 0.314 | 0.342 | 0.381 | 0.402 | 0.457 | 0.485 | 0.493 | 0.560 | 0.591 | 0.686 |
2D-WFT/nm | 0.291 | 0.320 | 0.351 | 0.376 | 0.414 | 0.420 | 0.442 | 0.469 | 0.495 | 0.574 |
2D-FWT/nm | 0.280 | 0.300 | 0.344 | 0.364 | 0.412 | 0.395 | 0.428 | 0.436 | 0.464 | 0.531 |
Original Experiment | Sensitivity Comparison Experiment | |||||
---|---|---|---|---|---|---|
Max Error | Mean Error | Std Error | Max Error | Mean Error | Std Error | |
2D-FFT | 8.54 | 7.21 | 0.799 | 9.31 | 8.32 | 0.973 |
2D-WFT | 7.65 | 6.50 | 0.804 | 8.74 | 7.76 | 1.034 |
2D-FWT | 6.75 | 6.07 | 0.544 | 7.83 | 7.34 | 0.713 |
Source of Uncertainty | |||
---|---|---|---|
Grating period | 1 × 10−7 | ||
Grating surface quality | 1 × 10−6 | ||
Grating line shape | 1 × 10−7 | ||
Grating etching depth | 1 × 10−6 | ||
Equipment stability | 1 × 10−6 | ||
Grating manufacturing process | 1 × 10−6 | ||
Temperature variation | 1 × 10−5 | ||
Mechanical vibrations | 1 × 10−5 | ||
Air turbulence | 1 × 10−6 | ||
Electromagnetic interference | 1 × 10−5 | ||
Light stability | 1 × 10−3 | ||
Optical component quality | 1 × 10−3 | ||
PZT jitter | 1 × 10−2 | ||
Combined uncertainty |
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Xu, F.; Ding, Y.; Chen, W.; Xia, H. An Improved Algorithm to Extract Moiré Fringe Phase for Wafer-Mask Alignment in Nanoimprint Lithography. Micromachines 2024, 15, 1408. https://doi.org/10.3390/mi15121408
Xu F, Ding Y, Chen W, Xia H. An Improved Algorithm to Extract Moiré Fringe Phase for Wafer-Mask Alignment in Nanoimprint Lithography. Micromachines. 2024; 15(12):1408. https://doi.org/10.3390/mi15121408
Chicago/Turabian StyleXu, Feifan, Yinye Ding, Wenhao Chen, and Haojie Xia. 2024. "An Improved Algorithm to Extract Moiré Fringe Phase for Wafer-Mask Alignment in Nanoimprint Lithography" Micromachines 15, no. 12: 1408. https://doi.org/10.3390/mi15121408
APA StyleXu, F., Ding, Y., Chen, W., & Xia, H. (2024). An Improved Algorithm to Extract Moiré Fringe Phase for Wafer-Mask Alignment in Nanoimprint Lithography. Micromachines, 15(12), 1408. https://doi.org/10.3390/mi15121408