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Journal: Micromachines, 2024
Volume: 15
Number: 98

Article: Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices
Authors: by He Guan, Dong Wang, Wentao Li, Duo Liu, Borui Deng and Xiang Qu
Link: https://www.mdpi.com/2072-666X/15/1/98

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