Kim, J.; Kim, S.; Kim, B.; Choi, J.; Ahn, S.
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching. Micromachines 2023, 14, 1766.
https://doi.org/10.3390/mi14091766
AMA Style
Kim J, Kim S, Kim B, Choi J, Ahn S.
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching. Micromachines. 2023; 14(9):1766.
https://doi.org/10.3390/mi14091766
Chicago/Turabian Style
Kim, Jonghyeok, Sungil Kim, Byungjoo Kim, Jiyeon Choi, and Sanghoon Ahn.
2023. "Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching" Micromachines 14, no. 9: 1766.
https://doi.org/10.3390/mi14091766
APA Style
Kim, J., Kim, S., Kim, B., Choi, J., & Ahn, S.
(2023). Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching. Micromachines, 14(9), 1766.
https://doi.org/10.3390/mi14091766