Article Versions Notes

Zhou H, Chang A, Fan J, Cao J, An B, Xia J, Yao J, Cui X, Zhang Y. Copper Wire Bonding: A Review. Micromachines. 2023; 14(8):1612. https://doi.org/10.3390/mi14081612

Zhou, Hongliang, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui, and Yingchong Zhang. 2023. "Copper Wire Bonding: A Review" Micromachines 14, no. 8: 1612. https://doi.org/10.3390/mi14081612

Zhou, H., Chang, A., Fan, J., Cao, J., An, B., Xia, J., Yao, J., Cui, X., & Zhang, Y. (2023). Copper Wire Bonding: A Review. Micromachines, 14(8), 1612. https://doi.org/10.3390/mi14081612