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Journal: Micromachines, 2023
Volume: 14
Number: 1510

Article: Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams
Authors: by Haotian Yang, Min Liu, Yingmin Zhu, Weidong Wang, Xianming Qin, Lilong He and Kyle Jiang
Link: https://www.mdpi.com/2072-666X/14/8/1510

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