Shi, L.; Yu, F.; Ding, M.; Hang, Z.; Feng, Y.; Yan, A.; Dong, H.
Connection of ssDNA to Silicon Substrate Based on a Mechano–Chemical Method. Micromachines 2023, 14, 1134.
https://doi.org/10.3390/mi14061134
AMA Style
Shi L, Yu F, Ding M, Hang Z, Feng Y, Yan A, Dong H.
Connection of ssDNA to Silicon Substrate Based on a Mechano–Chemical Method. Micromachines. 2023; 14(6):1134.
https://doi.org/10.3390/mi14061134
Chicago/Turabian Style
Shi, Liqiu, Feng Yu, Mingming Ding, Zhouming Hang, Yan Feng, Aifang Yan, and Hongji Dong.
2023. "Connection of ssDNA to Silicon Substrate Based on a Mechano–Chemical Method" Micromachines 14, no. 6: 1134.
https://doi.org/10.3390/mi14061134
APA Style
Shi, L., Yu, F., Ding, M., Hang, Z., Feng, Y., Yan, A., & Dong, H.
(2023). Connection of ssDNA to Silicon Substrate Based on a Mechano–Chemical Method. Micromachines, 14(6), 1134.
https://doi.org/10.3390/mi14061134