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Journal: Micromachines, 2023
Volume: 14
Number: 803

Article: Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging
Authors: by Jinxu Liu, Jihua Zhang, Libin Gao and Hongwei Chen
Link: https://www.mdpi.com/2072-666X/14/4/803

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