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Journal: Micromachines, 2023
Volume: 14
Number: 803
Article:
Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging
Authors:
by
Jinxu Liu, Jihua Zhang, Libin Gao and Hongwei Chen
Link:
https://www.mdpi.com/2072-666X/14/4/803
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