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Journal: Micromachines, 2023
Volume: 14
Number: 688
688
Article: Analysis and Hardening of SEGR in Trench VDMOS with Termination Structure
Authors: by Yuan Wang, Tao Liu, Lingli Qian, Hao Wu, Yiren Yu, Jingyu Tao, Zijun Cheng and Shengdong Hu
Link: https://www.mdpi.com/2072-666X/14/3/688

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