Next Article in Journal
Easy-to-Assembly System for Decellularization and Recellularization of Liver Grafts in a Bioreactor
Next Article in Special Issue
Waveform Design Method for Piezoelectric Print-Head Based on Iterative Learning and Equivalent Circuit Model
Previous Article in Journal
Studies of Performance of Cs2TiI6−XBrX (Where x = 0 to 6)-Based Mixed Halide Perovskite Solar Cell with CdS Electron Transport Layer
Previous Article in Special Issue
Effect of Acceptor Traps in GaN Buffer Layer on Breakdown Performance of AlGaN/GaN HEMTs
 
 

Order Article Reprints

Journal: Micromachines, 2023
Volume: 14
Number: 448

Article: Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter
Authors: by Taehyun Kim, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang and Hee Yeoun Kim
Link: https://www.mdpi.com/2072-666X/14/2/448

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop