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Journal: Micromachines, 2023
Volume: 14
Number: 448
448
Article: Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter
Authors: by Taehyun Kim, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang and Hee Yeoun Kim
Link: https://www.mdpi.com/2072-666X/14/2/448

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