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Article
Peer-Review Record

Thermodynamic Multi-Field Coupling Optimization of Microsystem Based on Artificial Intelligence

Micromachines 2023, 14(2), 411; https://doi.org/10.3390/mi14020411
by Guangbao Shan 1, Xudong Wu 1, Guoliang Li 1,*, Chaoyang Xing 2, Shengchang Zhang 1 and Yu Fu 3,*
Reviewer 1: Anonymous
Reviewer 2: Anonymous
Micromachines 2023, 14(2), 411; https://doi.org/10.3390/mi14020411
Submission received: 30 December 2022 / Revised: 5 February 2023 / Accepted: 7 February 2023 / Published: 9 February 2023

Round 1

Reviewer 1 Report

Please see attached PDF comments and suggestions for authors.

Comments for author File: Comments.pdf

Author Response

Please see the attachment.

Author Response File: Author Response.docx

Reviewer 2 Report

1. Have you consider thermal conductivity layer in your modeling? Also, in general, it should have two thermal interface materials between chip and heat sink tank. These factors should be added in your FEM model.

2. Please describe more details related your FEM modeling process.

3. The deformation will be influence by many factors such as moisture adsorption, you need consider these in your FEM modeling.

4. The temperature in your modeling should be higher than 100 to consistent with the realistic chip manipulation temperature.

5. When you get your conclusion, you may can do at least one group of experiments to support your modeling data.

Author Response

Please see the attachment.

Author Response File: Author Response.docx

Round 2

Reviewer 1 Report

The authors have well-addressed the comments and suggestions. The paper is now ready for publication. Good jobs authors; congrats!

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