Su, G.; Zhang, C.; Li, J.; Liu, G.; Chen, X.; Zhang, Y.
Enhancing Cutting Rates in Multi-Channel HSWEDM of Metal Materials with a Novel Decoupling Circuit. Micromachines 2023, 14, 2226.
https://doi.org/10.3390/mi14122226
AMA Style
Su G, Zhang C, Li J, Liu G, Chen X, Zhang Y.
Enhancing Cutting Rates in Multi-Channel HSWEDM of Metal Materials with a Novel Decoupling Circuit. Micromachines. 2023; 14(12):2226.
https://doi.org/10.3390/mi14122226
Chicago/Turabian Style
Su, Guokang, Chuanyun Zhang, Junfei Li, Guixian Liu, Xiaolei Chen, and Yongjun Zhang.
2023. "Enhancing Cutting Rates in Multi-Channel HSWEDM of Metal Materials with a Novel Decoupling Circuit" Micromachines 14, no. 12: 2226.
https://doi.org/10.3390/mi14122226
APA Style
Su, G., Zhang, C., Li, J., Liu, G., Chen, X., & Zhang, Y.
(2023). Enhancing Cutting Rates in Multi-Channel HSWEDM of Metal Materials with a Novel Decoupling Circuit. Micromachines, 14(12), 2226.
https://doi.org/10.3390/mi14122226