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Journal: Micromachines, 2023
Volume: 14
Number: 1953

Article: An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks
Authors: by Ganglong Li, Yidian Shi, Andrew A. O. Tay and Zhilin Long
Link: https://www.mdpi.com/2072-666X/14/10/1953

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