Arshad, K.M.; Noor, M.M.; Manaf, A.A.; Kawarada, H.; Falina, S.; Syamsul, M.
A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513.
https://doi.org/10.3390/mi13091513
AMA Style
Arshad KM, Noor MM, Manaf AA, Kawarada H, Falina S, Syamsul M.
A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines. 2022; 13(9):1513.
https://doi.org/10.3390/mi13091513
Chicago/Turabian Style
Arshad, Khairul Mohd, Muhamad Mat Noor, Asrulnizam Abd Manaf, Hiroshi Kawarada, Shaili Falina, and Mohd Syamsul.
2022. "A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties" Micromachines 13, no. 9: 1513.
https://doi.org/10.3390/mi13091513
APA Style
Arshad, K. M., Noor, M. M., Manaf, A. A., Kawarada, H., Falina, S., & Syamsul, M.
(2022). A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines, 13(9), 1513.
https://doi.org/10.3390/mi13091513