Material Removal Mechanism in Photocatalytic−Assisted Jet Electrochemical Machining of SiCp/Al
Abstract
:1. Introduction
2. Principle of PAJECM Process
3. Experimental Setup
4. Experimental Results
5. Analysis and Discussion
5.1. Electrochemical Characterization Analysis
5.2. Elemental Energy Spectrum Analysis
5.3. Discussion
6. Conclusions
- (1)
- The material removal morphology of SiCp/Al in PAJECM significantly changed due to the addition of photocatalysis. The observation of the machined micro surface confirmed that the SiC particles with poor conductivity are effectively removed. Compared with JECM, the surface roughness value of PAJECM decreases from Ra 2.5 to Ra 1.5 μm when the processing voltage is 10 V, and the surface roughness value decreased from Ra 5.7 to Ra 2.7 μm when the processing voltage is 60 V. PAJECM significantly improves the surface quality of SiCp/Al machining.
- (2)
- By observing the material removal phenomenon, we found that the SiCp/Al material removal mechanism of PAJECM is significantly different from that of JECM. In PAJECM, the aluminum matrix and SiC particles are simultaneously removed. The aluminum matrix is removed by anodic dissolution. The SiC particles are removed by two steps: the hard SiC particles form a SiO2 layer under the photocatalytic reaction; the comparatively soft SiO2 layer is removed by the abrasive particle impact. In JECM, the aluminum matrix is also removed by anodic dissolution, while the SiC particles either fall off to form a pit or remain on the machined surface to form a protrusion.
- (3)
- The material removal mechanism of PAJECM was verified by its electrochemical polarization curves and the EDS results. After adding photocatalysis, the self−corrosion potential and decomposition potential of SiCp/Al significantly increase, which proves that the intense oxidizing substance •OH is generated during processing. After processing, the oxygen content on the surface is obviously increased, and the distribution of oxygen and silicon is consistent, which proves the formation of Si−containing oxide SiO2.
Author Contributions
Funding
Institutional Review Board Statement
Data Availability Statement
Conflicts of Interest
References
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Processing Parameters | Value |
---|---|
Workpiece | SiCp/Al with 20% SiC volume fraction, thickness 3 mm |
Catalyst TiO2 concentration | 4 g/L |
H2O2 Volume fraction | 3% |
Electrolyte type and concentration | NaNO3, 15% |
UV light intensity | 1500 mW/cm2, 10 W, 365 nm wavelength |
Processing voltage | DC 10, 20, 30, 40, 50, 60 V |
Processing time | 30 s |
Flow rate | 200 mL/min |
Stainless-steel capillary nozzle | Inner diameter (ID) 0.8 mm, outer diameter (OD) 1 mm |
Inter−electrode gap | 0.3 mm |
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Wang, F.; Zhou, J.; Wu, S.; Kang, X.; Gu, L.; Zhao, W. Material Removal Mechanism in Photocatalytic−Assisted Jet Electrochemical Machining of SiCp/Al. Micromachines 2022, 13, 1482. https://doi.org/10.3390/mi13091482
Wang F, Zhou J, Wu S, Kang X, Gu L, Zhao W. Material Removal Mechanism in Photocatalytic−Assisted Jet Electrochemical Machining of SiCp/Al. Micromachines. 2022; 13(9):1482. https://doi.org/10.3390/mi13091482
Chicago/Turabian StyleWang, Feng, Jing Zhou, Siyi Wu, Xiaoming Kang, Lin Gu, and Wansheng Zhao. 2022. "Material Removal Mechanism in Photocatalytic−Assisted Jet Electrochemical Machining of SiCp/Al" Micromachines 13, no. 9: 1482. https://doi.org/10.3390/mi13091482