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Journal: Micromachines, 2022
Volume: 13
Number: 1307
1307
Article: Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils
Authors: by Christian Hofmann, Maulik Satwara, Martin Kroll, Sushant Panhale, Patrick Rochala, Maik Wiemer, Karla Hiller and Harald Kuhn
Link: https://www.mdpi.com/2072-666X/13/8/1307

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