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Journal: Micromachines, 2022
Volume: 13
Number: 738
738
Article: Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors
Authors: by Yuanjie Wan, Zhiwei Li, Zile Huang, Baofa Hu, Wenlong Lv, Chunquan Zhang, Haisheng San and Shaoda Zhang
Link: https://www.mdpi.com/2072-666X/13/5/738

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