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Journal: MicromachinesVolume: 13Number: 583
Article: An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
  • Authors:
  • Zehua Chen1,*,
  • Ulrich Gengenbach1 and
  • Xinnan Liu1
  • et al.
Link: https://www.mdpi.com/2072-666X/13/4/583

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