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Journal: Micromachines, 2022
Volume: 13
Number: 567

Article: Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip
Authors: by Peng Yuan, Danian Dong, Xu Zheng, Guozhong Xing and Xiaoxin Xu
Link: https://www.mdpi.com/2072-666X/13/4/567

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