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Journal: Micromachines, 2022
Volume: 13
Number: 554

Article: Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling
Authors: by Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan and Hui Quan
Link: https://www.mdpi.com/2072-666X/13/4/554

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