Tan, L.; Liu, P.; She, C.; Xu, P.; Yan, L.; Quan, H.
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. Micromachines 2022, 13, 554.
https://doi.org/10.3390/mi13040554
AMA Style
Tan L, Liu P, She C, Xu P, Yan L, Quan H.
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. Micromachines. 2022; 13(4):554.
https://doi.org/10.3390/mi13040554
Chicago/Turabian Style
Tan, Lipeng, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan, and Hui Quan.
2022. "Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling" Micromachines 13, no. 4: 554.
https://doi.org/10.3390/mi13040554
APA Style
Tan, L., Liu, P., She, C., Xu, P., Yan, L., & Quan, H.
(2022). Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. Micromachines, 13(4), 554.
https://doi.org/10.3390/mi13040554