Pak, A.; Nanbakhsh, K.; Hölck, O.; Ritasalo, R.; Sousa, M.; Van Gompel, M.; Pahl, B.; Wilson, J.; Kallmayer, C.; Giagka, V.
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. Micromachines 2022, 13, 544.
https://doi.org/10.3390/mi13040544
AMA Style
Pak A, Nanbakhsh K, Hölck O, Ritasalo R, Sousa M, Van Gompel M, Pahl B, Wilson J, Kallmayer C, Giagka V.
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. Micromachines. 2022; 13(4):544.
https://doi.org/10.3390/mi13040544
Chicago/Turabian Style
Pak, Anna, Kambiz Nanbakhsh, Ole Hölck, Riina Ritasalo, Maria Sousa, Matthias Van Gompel, Barbara Pahl, Joshua Wilson, Christine Kallmayer, and Vasiliki Giagka.
2022. "Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation" Micromachines 13, no. 4: 544.
https://doi.org/10.3390/mi13040544
APA Style
Pak, A., Nanbakhsh, K., Hölck, O., Ritasalo, R., Sousa, M., Van Gompel, M., Pahl, B., Wilson, J., Kallmayer, C., & Giagka, V.
(2022). Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation. Micromachines, 13(4), 544.
https://doi.org/10.3390/mi13040544
