Wang, S.; Wang, Y.; Zhang, S.; Wang, L.; Chen, S.; Zheng, H.; Zhang, C.; Liu, S.; Cheng, G.J.; Liu, F.
Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation. Micromachines 2021, 12, 1188.
https://doi.org/10.3390/mi12101188
AMA Style
Wang S, Wang Y, Zhang S, Wang L, Chen S, Zheng H, Zhang C, Liu S, Cheng GJ, Liu F.
Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation. Micromachines. 2021; 12(10):1188.
https://doi.org/10.3390/mi12101188
Chicago/Turabian Style
Wang, Shuai, Yaoyu Wang, Shizhuo Zhang, Lingfeng Wang, Shuai Chen, Huai Zheng, Chen Zhang, Sheng Liu, Gary J. Cheng, and Feng Liu.
2021. "Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation" Micromachines 12, no. 10: 1188.
https://doi.org/10.3390/mi12101188
APA Style
Wang, S., Wang, Y., Zhang, S., Wang, L., Chen, S., Zheng, H., Zhang, C., Liu, S., Cheng, G. J., & Liu, F.
(2021). Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation. Micromachines, 12(10), 1188.
https://doi.org/10.3390/mi12101188
