Ling, S.; Li, M.; Liu, Y.; Wang, K.; Jiang, Y.
Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode. Micromachines 2020, 11, 698.
https://doi.org/10.3390/mi11070698
AMA Style
Ling S, Li M, Liu Y, Wang K, Jiang Y.
Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode. Micromachines. 2020; 11(7):698.
https://doi.org/10.3390/mi11070698
Chicago/Turabian Style
Ling, Siying, Minghao Li, Yong Liu, Kan Wang, and Yong Jiang.
2020. "Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode" Micromachines 11, no. 7: 698.
https://doi.org/10.3390/mi11070698
APA Style
Ling, S., Li, M., Liu, Y., Wang, K., & Jiang, Y.
(2020). Improving Machining Localization and Surface Roughness in Wire Electrochemical Micromachining Using a Rotating Ultrasonic Helix Electrode. Micromachines, 11(7), 698.
https://doi.org/10.3390/mi11070698