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Journal: Micromachines, 2020
Volume: 11
Number: 170

Article: Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device
Authors: by Yinhua Cui, Jeong Yeul Jeong, Yuan Gao and Sung Gyu Pyo
Link: https://www.mdpi.com/2072-666X/11/2/170

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