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Open AccessArticle

Fully-Differential TPoS Resonators Based on Dual Interdigital Electrodes for Feedthrough Suppression

School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
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Micromachines 2020, 11(2), 119; https://doi.org/10.3390/mi11020119
Received: 22 December 2019 / Revised: 10 January 2020 / Accepted: 15 January 2020 / Published: 21 January 2020
As one of the core components of MEMS (i.e., micro-electro-mechanical systems), thin-film piezoelectric-on-silicon (TPoS) resonators experienced a blooming development in the past decades due to unique features such as a remarkable capability of integration for attractive applications of system-on-chip integrated timing references. However, the parasitic capacitive feedthrough poses a great challenge to electrical detection of resonance in a microscale silicon-based mechanical resonator. Herein, a fully-differential configuration of a TPoS MEMS resonator based on a novel structural design of dual interdigital electrodes is proposed to eliminate the negative effect of feedthrough. The fundamental principle of feedthrough suppression was comprehensively investigated by using FEA (i.e., finite-element analysis) modeling and electrical measurements of fabricated devices. It was shown that with the help of fully-differential configuration, the key parameter of SBR (i.e., signal-to-background ratio) was significantly enhanced by greatly suppressing the in-phase signal. The S-parameter measurement results further verified the effectiveness of this novel feedthrough suppression strategy, and the insertion loss and SBR of proposed TPoS resonators were improved to 4.27 dB and 42.47 dB, respectively. View Full-Text
Keywords: MEMS; resonator; TPoS; feedthrough; differential-in; differential-out MEMS; resonator; TPoS; feedthrough; differential-in; differential-out
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Zhang, Y.; Bao, J.-F.; Li, X.-Y.; Zhou, X.; Wu, Z.-H.; Zhang, X.-S. Fully-Differential TPoS Resonators Based on Dual Interdigital Electrodes for Feedthrough Suppression. Micromachines 2020, 11, 119.

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