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Micromachines 2019, 10(2), 82; https://doi.org/10.3390/mi10020082

A New Stress-Released Structure to Improve the Temperature Stability of the Butterfly Vibratory Gyroscope

College of Intelligence Science and Engineering, National University of Defense Technology, Changsha 410073, China
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Received: 27 December 2018 / Revised: 18 January 2019 / Accepted: 21 January 2019 / Published: 24 January 2019
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Abstract

This paper is devoted to discussing the influence of thermal stress on the performance of the Butterfly Vibratory Gyroscope (BFVG). In many gyroscopes, due to the material properties and the fabrication processes, the deformation caused by residual stress or thermal mechanical stress is of great concern since it directly affects the performance. Here, a new stress-released structure was proposed to reduce the deformation to improve BFVG’s performance considering the symmetry of the electrode and the miniaturization of the structure. Its dimensional parameters relate to the effect of thermal stress release and the stiffness characteristics of the BFVG’s oblique beam. The single parameter analysis method was used to explore the influence of the parameters on the effect of thermal stress release to guide the optimal size of the final design. The effect of thermal stress release in the BFVG at the full range temperature was also tested after the fabrication. The results showed that the influence of thermal stress on the BFVG’s performance effectively reduced. View Full-Text
Keywords: stress-released structure; frequency mismatch; temperature stability stress-released structure; frequency mismatch; temperature stability
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Ou, F.; Hou, Z.; Miao, T.; Xiao, D.; Wu, X. A New Stress-Released Structure to Improve the Temperature Stability of the Butterfly Vibratory Gyroscope. Micromachines 2019, 10, 82.

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