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Journal: Micromachines, 2019
Volume: 10
Number: 119
119
Article: Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films
Authors: by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh and Eiji Higurashi
Link: https://www.mdpi.com/2072-666X/10/2/119

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