Order Article Reprints

Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Itoh T, Higurashi E. Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films. Micromachines. 2019; 10(2):119. https://doi.org/10.3390/mi10020119

Yamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, and Eiji Higurashi. 2019. "Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films" Micromachines 10, no. 2: 119. https://doi.org/10.3390/mi10020119

Yamamoto, M., Matsumae, T., Kurashima, Y., Takagi, H., Suga, T., Itoh, T., & Higurashi, E. (2019). Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films. Micromachines, 10(2), 119. https://doi.org/10.3390/mi10020119