Abo-Zahhad, E.M.; Ghenai, C.; Radwan, A.; Abdelrehim, O.; Salem, M.S.; Elmarghany, M.R.; Khater, A.; Shouman, M.A.
A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems. Sustainability 2022, 14, 14182.
https://doi.org/10.3390/su142114182
AMA Style
Abo-Zahhad EM, Ghenai C, Radwan A, Abdelrehim O, Salem MS, Elmarghany MR, Khater A, Shouman MA.
A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems. Sustainability. 2022; 14(21):14182.
https://doi.org/10.3390/su142114182
Chicago/Turabian Style
Abo-Zahhad, Essam M., Chaouki Ghenai, Ali Radwan, Osama Abdelrehim, Mohamed S. Salem, Mohamed R. Elmarghany, Asmaa Khater, and Mahmoud A. Shouman.
2022. "A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems" Sustainability 14, no. 21: 14182.
https://doi.org/10.3390/su142114182
APA Style
Abo-Zahhad, E. M., Ghenai, C., Radwan, A., Abdelrehim, O., Salem, M. S., Elmarghany, M. R., Khater, A., & Shouman, M. A.
(2022). A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems. Sustainability, 14(21), 14182.
https://doi.org/10.3390/su142114182