Lei, Y.; Yang, G.; Du, F.; Yi, J.; Quan, L.; Liu, H.; Zhou, X.; Gong, W.; Han, J.; Wang, Y.;
et al. Formulation and Evaluation of a Drug-in-Adhesive Patch for Transdermal Delivery of Colchicine. Pharmaceutics 2022, 14, 2245.
https://doi.org/10.3390/pharmaceutics14102245
AMA Style
Lei Y, Yang G, Du F, Yi J, Quan L, Liu H, Zhou X, Gong W, Han J, Wang Y,
et al. Formulation and Evaluation of a Drug-in-Adhesive Patch for Transdermal Delivery of Colchicine. Pharmaceutics. 2022; 14(10):2245.
https://doi.org/10.3390/pharmaceutics14102245
Chicago/Turabian Style
Lei, Yaran, Guobao Yang, Feng Du, Jiahe Yi, Liangzhu Quan, Hanhan Liu, Xun Zhou, Wei Gong, Jing Han, Yuli Wang,
and et al. 2022. "Formulation and Evaluation of a Drug-in-Adhesive Patch for Transdermal Delivery of Colchicine" Pharmaceutics 14, no. 10: 2245.
https://doi.org/10.3390/pharmaceutics14102245
APA Style
Lei, Y., Yang, G., Du, F., Yi, J., Quan, L., Liu, H., Zhou, X., Gong, W., Han, J., Wang, Y., & Gao, C.
(2022). Formulation and Evaluation of a Drug-in-Adhesive Patch for Transdermal Delivery of Colchicine. Pharmaceutics, 14(10), 2245.
https://doi.org/10.3390/pharmaceutics14102245