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Open AccessArticle

A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects

by Weiwei Hu 1,2,†, Yaqiu Li 1,*,†, Yufeng Sun 1 and Ali Mosleh 2
1
Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China
2
B. John Garrick Institute for the Risk Sciences, University of California, Los Angeles, CA 90095, USA
*
Author to whom correspondence should be addressed.
These authors contributed equally to this work.
Academic Editor: Yoshiharu Mutoh
Materials 2016, 9(10), 860; https://doi.org/10.3390/ma9100860
Received: 20 August 2016 / Revised: 2 October 2016 / Accepted: 13 October 2016 / Published: 24 October 2016
(This article belongs to the Special Issue Fracture and Fatigue Mechanics of Materials)
Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper proposes a thermal fatigue life prediction model for ball grid array (BGA) packages to take into consideration the load sequence effects. For the purpose of improving the availability and accessibility of testing data, a new failure criterion is discussed and verified by simulation and experimentation. The consequences for the fatigue underlying sequence load conditions are shown. View Full-Text
Keywords: BGA; life prediction; load sequence effects; crack growth; damage accumulation; resistance strain BGA; life prediction; load sequence effects; crack growth; damage accumulation; resistance strain
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MDPI and ACS Style

Hu, W.; Li, Y.; Sun, Y.; Mosleh, A. A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects. Materials 2016, 9, 860.

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