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Journal: Materials, 2013
Volume: 6
Number: 244
Article:
Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer
Authors:
by
Wu Zhou, Huijun Yu, Bei Peng, Huaqin Shen, Xiaoping He and Wei Su
Link:
https://www.mdpi.com/1996-1944/6/1/244
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