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Journal: Materials, 2013
Volume: 6
Number: 244

Article: Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer
Authors: by Wu Zhou, Huijun Yu, Bei Peng, Huaqin Shen, Xiaoping He and Wei Su
Link: https://www.mdpi.com/1996-1944/6/1/244

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