Article Versions Notes

Xing Y, Du Y, Chu M, Jiao P, Fu Y, Sun Z, Dong M, Huang Y. Stage-Wise Curing for Improving the Bonding Strength of Imaging Coupling Devices. Materials. 2026; 19(8):1562. https://doi.org/10.3390/ma19081562

Xing, Yuwen, Yajie Du, Miao Chu, Peng Jiao, Yang Fu, Zeping Sun, Miao Dong, and Yonggang Huang. 2026. "Stage-Wise Curing for Improving the Bonding Strength of Imaging Coupling Devices" Materials 19, no. 8: 1562. https://doi.org/10.3390/ma19081562

Xing, Y., Du, Y., Chu, M., Jiao, P., Fu, Y., Sun, Z., Dong, M., & Huang, Y. (2026). Stage-Wise Curing for Improving the Bonding Strength of Imaging Coupling Devices. Materials, 19(8), 1562. https://doi.org/10.3390/ma19081562