Electrospun Conductive Composites with Anisotropic Microstructures and Tunable Mechanical Properties for Wearable Bioelectronics
Abstract
1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Fabrication of Electrospun Membranes
2.3. Fabrication of Composite Conductive Membranes
2.4. Characterization and Testing Methods
3. Results and Discussion
3.1. Microstructural Analysis of Composite Membranes
3.2. Mechanical Performance Analysis
3.3. Electrical Performance Analysis
3.4. Electrode-Skin Interface Impedance Characteristics
| Dimension | Material System | Structural Design Strategy | Mechanical Performance | Electrical Performance | Demonstrated Application |
|---|---|---|---|---|---|
| MXene Composite Fibers (2025) [66] | MXene, CNTs, PLA | Static-dynamic densification | Ultrahigh strength (941.5 MPa) | High electronic conductivity | Wireless e-textiles |
| Breathable Textile Electrodes (2026) [67] | Cotton, MXene, PEDOT:PSS | Surface functionalization coating | Intrinsic fabric flexibility | Stable for biopotentials | ECG, EMG, EEG monitoring |
| TPEE/PPy Membrane (2026) [68] | TPEE fibers, PPy, TA | Electrospun substrate in situ polymerization | High stretchability (0.4–1.3 Mpa) | Moderate electronic conductivity | AI diagnosis |
| WADE-Skin (2023) [69] | SBS/PAAND fibers, EGaIn | Multilayer fibrous stack | Skin-like softness (850 kPa) | Low impedance | ECG and HMI |
| PEO/Ionogel Membranes (This Study) | PEO fibers, ([EMIm][DCA]) | Programmable fiber alignment | Programmable anisotropy (1–74 MPa) | Stable ionic conductivity | bioelectronic interfaces for ECG and EMG |
3.5. Physiological Electrical Signal Monitoring Application
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Polymer | PEO | PCL | PVA | TPU | PVDF | PAN |
|---|---|---|---|---|---|---|
| Young’s modulus | 1–74 MPa | 3–5 MPa | 1–10 MPa | 1–10 MPa | 3–15 MPa | 5.7–9.4 MPa |
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Liu, J.; Liu, C.; Du, A.; Liu, Y.; Feng, Y.; Zhang, Y.; Pan, Z.; Lu, L.; Mao, Y. Electrospun Conductive Composites with Anisotropic Microstructures and Tunable Mechanical Properties for Wearable Bioelectronics. Materials 2026, 19, 684. https://doi.org/10.3390/ma19040684
Liu J, Liu C, Du A, Liu Y, Feng Y, Zhang Y, Pan Z, Lu L, Mao Y. Electrospun Conductive Composites with Anisotropic Microstructures and Tunable Mechanical Properties for Wearable Bioelectronics. Materials. 2026; 19(4):684. https://doi.org/10.3390/ma19040684
Chicago/Turabian StyleLiu, Jing, Chang Liu, Ankang Du, Yiming Liu, Yunxiang Feng, Yujie Zhang, Zhifeng Pan, Lijun Lu, and Yanchao Mao. 2026. "Electrospun Conductive Composites with Anisotropic Microstructures and Tunable Mechanical Properties for Wearable Bioelectronics" Materials 19, no. 4: 684. https://doi.org/10.3390/ma19040684
APA StyleLiu, J., Liu, C., Du, A., Liu, Y., Feng, Y., Zhang, Y., Pan, Z., Lu, L., & Mao, Y. (2026). Electrospun Conductive Composites with Anisotropic Microstructures and Tunable Mechanical Properties for Wearable Bioelectronics. Materials, 19(4), 684. https://doi.org/10.3390/ma19040684

