Article Versions Notes

Liu J, Qiu L, Wang P, Wang F, Huang J, Chen H, Zhao H, Chen F. Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review. Materials. 2026; 19(18):3937. https://doi.org/10.3390/ma19183937

Liu, Jiahao, Lijin Qiu, Peizhong Wang, Feiyang Wang, Jixi Huang, Hongtao Chen, Hao Zhao, and Fangzhou Chen. 2026. "Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review" Materials 19, no. 18: 3937. https://doi.org/10.3390/ma19183937

Liu, J., Qiu, L., Wang, P., Wang, F., Huang, J., Chen, H., Zhao, H., & Chen, F. (2026). Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review. Materials, 19(18), 3937. https://doi.org/10.3390/ma19183937