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Journal: Materials, 2025
Volume: 18
Number: 1834
1834
Article: Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Authors: by Sang-Eun Han, Dong-Gyu Choi, Seonghui Han, Tae-Young Lee, Deok-Gon Han, Hoo-Jeong Lee and Sehoon Yoo
Link: https://www.mdpi.com/1996-1944/18/8/1834

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