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Open AccessArticle
Identification of Mechanical Parameters of the Silicon Structure of a Capacitive MEMS Accelerometer
1
Department of Theoretical and Applied Mechanics, Faculty of Mechanical Engineering Technology, Silesian University of Technology, Konarskiego 18A, 44-100 Gliwice, Poland
2
Materials Research Laboratory, Faculty of Mechanical Engineering Technology, Silesian University of Technology, Konarskiego 18A, 44-100 Gliwice, Poland
*
Author to whom correspondence should be addressed.
Materials 2025, 18(24), 5676; https://doi.org/10.3390/ma18245676 (registering DOI)
Submission received: 11 November 2025
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Revised: 4 December 2025
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Accepted: 12 December 2025
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Published: 17 December 2025
Abstract
The aim of this study was to conduct an advanced analysis of the MEMS sensor, including both experimental tests and numerical simulations, in order to determine its mechanical properties and operational dynamics in detail. It is challenging to find publications in the literature that are not based on theoretical assumptions or general manufacturer data, which do not reflect the actual microstructural characteristics of the sensor. This study uses a numerical model developed in MATLAB/Simulink, which allows the experimentally determined material characteristics to be combined with predictive dynamic modelling. The model takes into account key mechanical parameters such as stiffness, damping and response to dynamic loads, and the built-in optimisation algorithm allows the structural parameters of the MEMS accelerometer to be estimated directly from experimental data. In addition, SEM microscopic studies and EDS chemical composition analysis provided detailed information on the sensor’s microstructure, allowing its impact on mechanical properties and dynamic parameters to be assessed. The integration of advanced experimental methods with numerical modelling has resulted in a model whose response closely matches the measurement results, which is an important step towards further research on design optimisation and improving the reliability of MEMS sensors in diverse operating conditions.
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MDPI and ACS Style
Kurpanik, K.; Gołombek, K.; Krzystała, E.; Hartwich, J.; Kciuk, S.
Identification of Mechanical Parameters of the Silicon Structure of a Capacitive MEMS Accelerometer. Materials 2025, 18, 5676.
https://doi.org/10.3390/ma18245676
AMA Style
Kurpanik K, Gołombek K, Krzystała E, Hartwich J, Kciuk S.
Identification of Mechanical Parameters of the Silicon Structure of a Capacitive MEMS Accelerometer. Materials. 2025; 18(24):5676.
https://doi.org/10.3390/ma18245676
Chicago/Turabian Style
Kurpanik, Kamil, Klaudiusz Gołombek, Edyta Krzystała, Jonasz Hartwich, and Sławomir Kciuk.
2025. "Identification of Mechanical Parameters of the Silicon Structure of a Capacitive MEMS Accelerometer" Materials 18, no. 24: 5676.
https://doi.org/10.3390/ma18245676
APA Style
Kurpanik, K., Gołombek, K., Krzystała, E., Hartwich, J., & Kciuk, S.
(2025). Identification of Mechanical Parameters of the Silicon Structure of a Capacitive MEMS Accelerometer. Materials, 18(24), 5676.
https://doi.org/10.3390/ma18245676
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