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Journal: Materials, 2025
Volume: 18
Number: 5615

Article: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers
Authors: by Hong Chen, Seul Lee, Minseung Kang, Hye Seon Youn, Seongwon Go, Eunsook Kang and Chae-Ryong Cho
Link: https://www.mdpi.com/1996-1944/18/24/5615

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