Wang, J.; Zhang, S.; Yan, C.; Li, H.; Yin, S.; Tang, Y.
Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. Materials 2025, 18, 5011.
https://doi.org/10.3390/ma18215011
AMA Style
Wang J, Zhang S, Yan C, Li H, Yin S, Tang Y.
Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. Materials. 2025; 18(21):5011.
https://doi.org/10.3390/ma18215011
Chicago/Turabian Style
Wang, Junxiang, Shiwei Zhang, Caiman Yan, Hongming Li, Shubin Yin, and Yong Tang.
2025. "Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity" Materials 18, no. 21: 5011.
https://doi.org/10.3390/ma18215011
APA Style
Wang, J., Zhang, S., Yan, C., Li, H., Yin, S., & Tang, Y.
(2025). Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. Materials, 18(21), 5011.
https://doi.org/10.3390/ma18215011