Leakage-Proof and High-Conductivity Composite Phase Change Material Using Low-Melting-Point-Alloy-Encapsulated Copper Foam/Paraffin for Superior Thermal Homogeneity in Lithium-Ion Battery Modules
Highlights
- A novel LMA-encapsulated CPCM was developed using a PA/CF matrix, solving leakage issues effectively.
- Thermal conductivity reached 4.42 W·m−1·K−1 with 10 PPI copper foam, a significant enhancement.
- Maximum battery temperature was reduced by 31.3 °C (from 75.9 °C to 44.6 °C) at a 3C discharge rate.
- The maximum temperature difference between cells was drastically reduced to a safe 1.2 °C, ensuring uniformity.
Abstract
Share and Cite
He, S.; Zhao, J.; Ouyang, D.; Chen, M. Leakage-Proof and High-Conductivity Composite Phase Change Material Using Low-Melting-Point-Alloy-Encapsulated Copper Foam/Paraffin for Superior Thermal Homogeneity in Lithium-Ion Battery Modules. Materials 2025, 18, 4604. https://doi.org/10.3390/ma18194604
He S, Zhao J, Ouyang D, Chen M. Leakage-Proof and High-Conductivity Composite Phase Change Material Using Low-Melting-Point-Alloy-Encapsulated Copper Foam/Paraffin for Superior Thermal Homogeneity in Lithium-Ion Battery Modules. Materials. 2025; 18(19):4604. https://doi.org/10.3390/ma18194604
Chicago/Turabian StyleHe, Shengzhi, Jiajun Zhao, Dongxu Ouyang, and Mingyi Chen. 2025. "Leakage-Proof and High-Conductivity Composite Phase Change Material Using Low-Melting-Point-Alloy-Encapsulated Copper Foam/Paraffin for Superior Thermal Homogeneity in Lithium-Ion Battery Modules" Materials 18, no. 19: 4604. https://doi.org/10.3390/ma18194604
APA StyleHe, S., Zhao, J., Ouyang, D., & Chen, M. (2025). Leakage-Proof and High-Conductivity Composite Phase Change Material Using Low-Melting-Point-Alloy-Encapsulated Copper Foam/Paraffin for Superior Thermal Homogeneity in Lithium-Ion Battery Modules. Materials, 18(19), 4604. https://doi.org/10.3390/ma18194604

