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Journal: Materials, 2025
Volume: 18
Number: 3725
3725
Article: Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu
Authors: by Jian-Yuan Huang, Dinh-Phuc Tran, Kang-Ping Lee, Yi-Quan Lin, Emile Kuo, Tsung-Chuan Chen, Yao-Tsung Chen, Stream Chung and Chih Chen
Link: https://www.mdpi.com/1996-1944/18/16/3725

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