Huang, J.-Y.; Tran, D.-P.; Lee, K.-P.; Lin, Y.-Q.; Kuo, E.; Chen, T.-C.; Chen, Y.-T.; Chung, S.; Chen, C.
Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu. Materials 2025, 18, 3725.
https://doi.org/10.3390/ma18163725
AMA Style
Huang J-Y, Tran D-P, Lee K-P, Lin Y-Q, Kuo E, Chen T-C, Chen Y-T, Chung S, Chen C.
Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu. Materials. 2025; 18(16):3725.
https://doi.org/10.3390/ma18163725
Chicago/Turabian Style
Huang, Jian-Yuan, Dinh-Phuc Tran, Kang-Ping Lee, Yi-Quan Lin, Emile Kuo, Tsung-Chuan Chen, Yao-Tsung Chen, Stream Chung, and Chih Chen.
2025. "Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu" Materials 18, no. 16: 3725.
https://doi.org/10.3390/ma18163725
APA Style
Huang, J.-Y., Tran, D.-P., Lee, K.-P., Lin, Y.-Q., Kuo, E., Chen, T.-C., Chen, Y.-T., Chung, S., & Chen, C.
(2025). Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu. Materials, 18(16), 3725.
https://doi.org/10.3390/ma18163725
