Wang, G.; Wang, Z.; Chai, F.; Wu, Z.; Luo, X.; Pan, T.
Simulation and Process Optimization of Online Cooling for S460 Thick Plates. Materials 2025, 18, 2599.
https://doi.org/10.3390/ma18112599
AMA Style
Wang G, Wang Z, Chai F, Wu Z, Luo X, Pan T.
Simulation and Process Optimization of Online Cooling for S460 Thick Plates. Materials. 2025; 18(11):2599.
https://doi.org/10.3390/ma18112599
Chicago/Turabian Style
Wang, Guangyuan, Zhen Wang, Feng Chai, Zhongwen Wu, Xiaobing Luo, and Tao Pan.
2025. "Simulation and Process Optimization of Online Cooling for S460 Thick Plates" Materials 18, no. 11: 2599.
https://doi.org/10.3390/ma18112599
APA Style
Wang, G., Wang, Z., Chai, F., Wu, Z., Luo, X., & Pan, T.
(2025). Simulation and Process Optimization of Online Cooling for S460 Thick Plates. Materials, 18(11), 2599.
https://doi.org/10.3390/ma18112599