Feng, R.; Wu, H.; Liu, H.; Yang, Y.; Pei, B.; Han, J.; Liu, Z.; Wu, X.; Huang, Z.
Effect of Ti Doping on the Microstructure and Properties of SiCp/Al Composites by Pressureless Infiltration. Materials 2024, 17, 1608.
https://doi.org/10.3390/ma17071608
AMA Style
Feng R, Wu H, Liu H, Yang Y, Pei B, Han J, Liu Z, Wu X, Huang Z.
Effect of Ti Doping on the Microstructure and Properties of SiCp/Al Composites by Pressureless Infiltration. Materials. 2024; 17(7):1608.
https://doi.org/10.3390/ma17071608
Chicago/Turabian Style
Feng, Ruijie, Haibo Wu, Huan Liu, Yitian Yang, Bingbing Pei, Jianshen Han, Zehua Liu, Xishi Wu, and Zhengren Huang.
2024. "Effect of Ti Doping on the Microstructure and Properties of SiCp/Al Composites by Pressureless Infiltration" Materials 17, no. 7: 1608.
https://doi.org/10.3390/ma17071608
APA Style
Feng, R., Wu, H., Liu, H., Yang, Y., Pei, B., Han, J., Liu, Z., Wu, X., & Huang, Z.
(2024). Effect of Ti Doping on the Microstructure and Properties of SiCp/Al Composites by Pressureless Infiltration. Materials, 17(7), 1608.
https://doi.org/10.3390/ma17071608
