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Journal: Materials, 2024
Volume: 17
Number: 755

Article: Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration
Authors: by Jisup Lee, Hyunsik Jeong and Gunhee Jang
Link: https://www.mdpi.com/1996-1944/17/3/755

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