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Journal: Materials, 2024
Volume: 17
Number: 5008
5008
Article: Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes
Authors: by Dan Liu, Liang Fang, Zhonghao Huang, Haibo Ruan, Wenxiang Chen, Jing Xiang, Fang Wu and Gaobin Liu
Link: https://www.mdpi.com/1996-1944/17/20/5008

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