Liu, D.; Fang, L.; Huang, Z.; Ruan, H.; Chen, W.; Xiang, J.; Wu, F.; Liu, G.
Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes. Materials 2024, 17, 5008.
https://doi.org/10.3390/ma17205008
AMA Style
Liu D, Fang L, Huang Z, Ruan H, Chen W, Xiang J, Wu F, Liu G.
Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes. Materials. 2024; 17(20):5008.
https://doi.org/10.3390/ma17205008
Chicago/Turabian Style
Liu, Dan, Liang Fang, Zhonghao Huang, Haibo Ruan, Wenxiang Chen, Jing Xiang, Fang Wu, and Gaobin Liu.
2024. "Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes" Materials 17, no. 20: 5008.
https://doi.org/10.3390/ma17205008
APA Style
Liu, D., Fang, L., Huang, Z., Ruan, H., Chen, W., Xiang, J., Wu, F., & Liu, G.
(2024). Formation Mechanism and Prevention of Cu Undercut Defects in the Photoresist Stripping Process of MoNb/Cu Stacked Electrodes. Materials, 17(20), 5008.
https://doi.org/10.3390/ma17205008
